Flex Films Presents the ‘Future of Packaging’ at PACK EXPO, USA – Reports IFCA Magazine | December 2018 Print Edition Post author:uflexltd-admin Post published:January 7, 2019 Post category:Blog Post comments:0 Comments Read more articles Previous PostUS Patent Granted to FlexFilms for Breakthrough BOPET Film Used for Alu Alu Blister PackNext PostGovernor of Kentucky The Honourable Matt Bevin Visits UFlex Plant in India You Might Also Like Making Customer’s Life Simpler – Mr. Anantshree Chaturvedi speaks with Packaging South Asia Magazine February 6, 2018 Uflex becomes Indian Banks’ Association (IBA) certified Security Printer May 16, 2018 First Anniversary of UFlex Khelo Dilli 2011-12 Held April 30, 2012 Leave a Reply Cancel replyCommentEnter your name or username to comment Enter your email address to comment Save my name, email, and website in this browser for the next time I comment. Enter your website URL (optional)
Making Customer’s Life Simpler – Mr. Anantshree Chaturvedi speaks with Packaging South Asia Magazine February 6, 2018